TS8010

Ultrasonic Sensor with IO-Link

Triad Semiconductor’s TS8010 is a highly integrated Ultrasonic Sensor Transmit / Receive Front End + Industrial Transceiver IC.  It combines a high voltage boost, an H-bridge piezo drive stage, a bandpass filtered high gain receive stage, high input voltage linear regulators, and user configurable high-voltage IO-Link / binary output stages.  The TS8010 provides a complete mixed-signal interface solution for multiple application modes and the next generation of small sensor form factors.

 

The TS8010 is available in a tiny xx-bump wafer level chip scale package (WLCSP, Xmm x Ymm, 0.5mm pitch).  The device operates from a +9V to +36V nominal supply input and is specified over a -25oC to +85oC operating temperature range.

Features

  • Complete Ultrasonic Sensor Transmit / Receive Front End + Industrial Interface Solution
  • Highly Configurable for a Wide Range of Sensor Applications
  • High Voltage Inductor Based Boost Regulator
  • High Voltage H-Bridge Modulated Piezo Transmit Driver
  • Bandpass Filtered High Gain Receive Channel
  • Dual Configurable Binary / IO-Link Outputs-Inputs
    • High Voltage, 100mA, PNP / NPN / Push-Pull
    • IO-Link Device Transceiver
  • +9V to +36V VCC Input Range (+24V typical)
    • Built in Linear Regulators for Quiet Analog and Digital Supplies
  • -25oC to +85oC Operating Temperature Range

Applications

  • Diffuse (Proximity Sensing), Retro-Reflective, Through-Beam (Opposed), and Double Sheet Ultrasonic Sensors
  • Factory Configurable Binary Output-Input Sensors
    • PNP / NPN / Push-Pull / Input
    • Normally Open / Normally Closed
  • IO-Link Field Configuration / Diagnostics

IC Diagram

IC Diagram

Application Circuit

Application Circuit

Additional Products

Triad Semiconductor’s TS8003 is a highly integrated Photoelectric Sensor Analog Front End + Power + Industrial Transceiver IC. It combines an optical source modulated transmit driver, dual high-performance photodiode receive channels, high input voltage DC-DC converter / linear regulators, and user configurable high-voltage IO-Link / binary output stages.  The TS8003 provides a complete mixed-signal interface solution for multiple application modes and the next generation of small sensor form factors.

The TS8003 is available in a tiny 30-bump wafer level chip scale package (WLCSP, 2.6mm x 3mm, 0.5mm pitch).  The device operates from a +9V to +36V nominal supply input and is specified over a -25oC to +85oC operating temperature range.

Details coming soon…