A routing layer fabricated over an existing die that redistributes the I/O pad connections to different locations. An example is a bumped die where the I/O pads are routed in the RDL to other locations suitable for placement of solder ball connections.
Triad offers customers “bumped die” packaging solutions in the form of WLCSP and flip chip packaging. Bumped die packaging can result in the smallest package size for a given die size and can be an excellent way to reduce package costs. A Redistribution Layer is needed for many bumped die packaging solutions.