An Optical DFN package will pass visible, ultra violet or infrared light through the package to opto-electronics within the package. An Optical DFN semiconductor package uses optically clear over molding material in place of the black plastic typical of QFN and DFN packages. ODFN packaging is used to combine photo-diodes or PIN diodes with processing electronics in the same package. Light passes through the transparent package and is detected by the photo-diode. Photo-diode electronics on the same die or in a separate die in the same package amplify the diode’s current and covert the signal to a usable voltage or digital output.
Triad provides complete optical process ASIC solutions that combine various photo detector options and mixed signal detector electronic ASIC in a single Optical DFN package. An Optical ASIC solution can greatly reduce opto sensor board area, power consumption and cost.