DIP or dual inline package is older and relatively large semiconductor packaging that originated in the 1960 as a result of the higher lead counts needed by integrated circuits. DIP packaging is referred to as through hole PCB technology because the DIP package pins pass through pads on a printed circuit board (PCB). DIP packaging is not typically the packaging option of chose for new designs.

Triad offers through hole packaging for obsolescence part replacement and for certain defense or safety applications that require a DIP package.