Bond Over Active Circuit layout techniques can reduce the overall die size of an integrated circuit. In a BOAC design, Instead of limiting bond pad locations to the perimeter of the die or in an open area of the layout, active circuits can be placed under the bond pad used for packaging connectivity. There are special layout design rules that must be followed for this bonding option. In addition, an IC design may impose additional restrictions on which active circuits that may be placed under the bondpad to guarantee chip performance adherence to the specification.
Triad supports Bond over active circuit (BOAC) layout and package options.