The 0.35 micron semiconductor technology node achieved widespread use in 1996. AMD’s Am486 processor contained 1-million transistors and required a die size of 32.94 square mms. This compares to the same design which when implemented at the 0.7 micron process node required a die size of 89 square mms. 0.35 micron has been an optimal process node for analog and mixed signal applications beginning in the early 2000’s. As digital-only applications moved to smaller and smaller process nodes, 0.35 micron foundries began adding analog capabilities to these process nodes. Today, 0.35 micron processes often support: precision analog features such as high resistance poly resistors, high voltage capabilities and non-volatile memory.
Triad offers a variety of 0.35 micron process technology options from a variety of foundry partners including: AMS, MagnaChip and TSMC. Triad has been shipping production ASICs on 0.35 micron processes since 2006.