Triad News

Smart sensors are the subject of our latest application note. Find out how Triad Semiconductor can develop your next smart sensor application: Read the Smart Sensor app note online or download the PDF.

We’ve just released our latest application note focusing on bioelectric amplifiers. View the app note online or download the PDF.

Montreal design group serves growing worldwide demand for mixed-signal ASIC support

WINSTON-SALEM, N.C. - Jan. 17, 2008 - Addressing rapidly increasing global interest in its mixed-signal ASIC solutions, fabless ASIC company Triad Semiconductor, Inc. today opened its first subsidiary - Triad MDG, Inc. in Montreal. Triad MDG is staffed by senior engineers under the direction of General Manager Richard Prescott. It expands Triad’s design operations and offers both advanced internal analog intellectual property (IP) development and design, as well as external sales and application engineering support for the Canadian market.

Triad Semiconductor develops, prototypes and produces mixed-signal ASICs in production volumes from the low thousands to the millions. It uses patent-pending single-mask Via Configurable Array (VCA) technology to create ASIC arrays using pre-designed silicon-proven analog and digital functions. This approach significantly reduces the time, cost and risk associated with full custom layout, delivering fast-turn prototypes and enabling post-design changes at minimal cost. Triad’s approach significantly reduces the engineering labor and fabrication costs of high-performance ASIC designs, and can speed “time-to-prototype” by more than half a year.

Lynn Hayden, chief executive officer at Triad Semiconductor said, “Opening Triad MDG signals a new phase in Triad’s business development. Having this Canadian subsidiary extends our support base and enables Triad to bring our cost-effective, high-performance mixed-signal ASIC designs to more companies involved in medical, industrial, communications, sensor and other applications. Customers worldwide are seeing the benefits with a lower NRE and faster time to production, along with the ability to make design changes quickly and inexpensively.”

Prescott added, “We are grateful for the assistance of Montréal International, which promotes economic development in Greater Montréal, during the key stages of our set-up, and for its continued help as we expand our activities here. Montréal has been an important center of commerce for many years, known for its aerospace, electronics, telecommunications and transportation industries, and for its engineering services and R&D. It is an ideal location for Triad MDG, and we look forward to serving companies throughout Canada and beyond with the cost and time benefits of Triad’s mixed-signal ASIC designs.”

About Triad MDG
Triad MDG, a wholly owned subsidiary of Triad Semiconductor, serves internal and customer needs for mixed-signal ASIC design. It is located at 3090 Le Carrefour Blvd., Suite 304, Laval, Quebec, H7T 2J1. Please visit www.triadsemi.com or call 514-518-8172.

About Triad Semiconductor
Triad Semiconductor is a fabless ASIC company that develops, prototypes and produces mixed-signal ASICs for production volumes from the low thousands to millions. Its patent-pending Via Configurable Array (VCA) technology creates ASIC arrays with silicon-proven analog and digital functions, reducing the time, cost and risk associated with full custom layout. Triad’s via-only routing also significantly reduces engineering effort and fabrication time, resulting in fast-turn prototypes and design changes at minimal cost. Founded in 2003 and privately held, Triad is headquartered in Winston Salem, N.C. For more information, visit www.triadsemi.com.

La nouvelle filiale permettra de répondre à la croissance de la demande mondiale de puces à signaux mixtes

Montréal, le 17 janvier 2008 - Afin de satisfaire la croissance rapide de la demande mondiale pour ses solutions de circuits intégrés spécifiques (Application Specific Integrated Circuit, ou ASIC) à signaux mixtes, la compagnie américaine Triad Semiconductor a inauguré aujourd’hui sa première filiale, Triad MDG (Montréal Design Group), à Laval, dans la région de Montréal. Les ingénieurs chevronnés de Triad MDG travaillent sous la supervision du directeur général, M. Richard Prescott. Triad MDG offre des services de conception et de développement de propriété intellectuelle analogique interne de pointe, ainsi que des services de soutien aux ventes et au développement d’applications pour le marché canadien.

M. Lynn Hayden, président-directeur général de Triad Semiconductor, explique : « L’ouverture de Triad MDG marque une nouvelle étape du développement de Triad. Cette filiale canadienne nous permettra d’accroître notre infrastructure de soutien et de proposer nos solutions performantes et économiques à davantage d’entreprises développant des applications médicales, industrielles, de communications, de détection, etc. Partout dans le monde, nos clients bénéficient des avantages d’une réduction des coûts récurrents d’ingénierie et d’une mise en Å“uvre accélérée, tout en pouvant apporter des modifications techniques rapidement. »

Montréal International a assisté Triad Semiconductor à toutes les étapes clés du projet et continuera de favoriser l’expansion de ses activités dans le Grand Montréal. Pour M. Pierre Brunet, président du conseil d’administration de Montréal International, « la décision de Triad Semiconductor d’ouvrir sa première filiale canadienne à Laval est une excellente nouvelle, illustrant les nombreux avantages offerts aux entreprises étrangères qui décident d’investir dans la région ».

M. Prescott ajoute : « Le Grand Montréal est un important centre de haute technologie, reconnu pour ses entreprises Å“uvrant dans les domaines de l’aérospatiale, de l’électronique, des télécommunications, des sciences de la vie et des transports, ainsi que pour ses services d’ingénierie et de recherche et développement. C’est l’endroit idéal pour Triad MDG, ce qui nous permettra de proposer aux entreprises du Canada et d’ailleurs les avantages de nos circuits intégrés à signaux mixtes en termes d’économies de temps et d’argent. »

« La région de Montréal est également reconnue pour le dynamisme de son environnement d’affaires, sa main-d’Å“uvre multilingue et hautement qualifiée, l’excellente réputation de ses universités, la vitalité et la créativité de ses entrepreneurs et industries culturelles, sans oublier son coût de la vie très raisonnable et sa qualité de vie unique en Amérique du Nord », conclut M. Brunet.

Pour sa part, M. Pierre Desroches, président du conseil de LAVAL TECHNOPOLE, s’est dit très heureux d’accueillir Triad Semiconductor au sein de Laval Technopole. « Triad vient ainsi enrichir la masse critique du e-PÔLE lavallois en se joignant à un réseau d’entreprises de calibre international, capables d’inventer, de produire, de commercialiser et de compétitionner partout dans le monde », a-t-il ajouté.

Triad MDG est une filiale en propriété exclusive de Triad Semiconductor. Elle est située au 3090, boulevard Le Carrefour, bureau 304, Laval (Québec).

À propos de Triad Semiconductor (www.triadsemi.com)
Triad Semiconductor effectue le développement, le prototypage et la production sans fabrication de puces ASIC à signaux mixtes pour des volumes de production allant de quelques milliers à des millions d’unités. Sa technologie Via Configurable Array (VCA) (brevet en instance) permet de créer des matrices ASIC avec des fonctions analogiques et numériques sur silicium éprouvées qui réduisent le temps, le coût et les risques liés aux configurations entièrement personnalisées. De plus, le routage réalisé uniquement par trous d’interconnexion de Triad facilite grandement les tâches d’ingénierie et accélère la fabrication, ce qui permet de développer des prototypes et d’appliquer des modifications techniques rapidement et à un coût minime. Fondée en 2003, Triad est une compagnie privée ayant son siège social à Winston Salem, en Caroline du Nord.

À propos de Montréal International (www.montrealinternational.com)
Créé en 1996, Montréal International est issu d’un partenariat privé-public. Il a pour mission de contribuer au développement économique du Montréal métropolitain et d’accroître son rayonnement international. Montréal International a comme mandats d’attirer dans la région métropolitaine les investissements étrangers, les organisations internationales et la main-d’Å“uvre stratégique, ainsi que de soutenir le développement de l’innovation et des grappes de haute technologie. L’organisme est financé par le secteur privé, la Communauté métropolitaine de Montréal, la Ville de Montréal ainsi que les gouvernements du Québec et du Canada.

Depuis l’an 2000, Montréal International a contribué à 379 projets d’investissements directs étrangers totalisant 5,6 milliards de dollars. Ces investissements ont permis de créer 28 186 emplois et d’en maintenir 5 459.

Contact :

Céline Clément
Montréal International
(514) 987-9390
celine.clement@montrealinternational.com

MELVILLE, N.Y. and WINSTON-SALEM, N.C. - Dec. 10, 2007 - The North American Components business of Arrow Electronics, Inc. (NYSE: ARW) and Triad Semiconductor, Inc., a leading mixed-signal ASIC provider, will make Triad’s mixed-signal via-configurable array ASICs available through Arrow’s North American sales and design centers.

Arrow will provide technical sales and support and product logistics for Triad’s mixed-signal ASIC customers. Triad’s patent-pending approach significantly reduces engineering labor and fabrication costs for high-performance ASIC designs, and can speed “time-to-prototype” by more than half a year.

“As designs become more highly integrated, many of our customers have been asking for mixed-signal ASIC support,” said Chris Miller, director of the customer logic solutions group of Arrow’s North America Components business. “Over the last 6 months, we’ve seen a significant interest in Triad’s technology. Customers appreciate how Triad has addressed their analog integration challenge with a competitive and flexible single-mask programmable technology. Customers are seeing the benefits with a lower NRE, faster time to production, along with the ability to make design changes quickly and inexpensively.”

“Arrow is the ideal strategic design and distribution partner, with its outstanding design support and unparalleled reach to 40,000 customers throughout North America,” said Lynn Hayden, chief executive officer at Triad Semiconductor. “Our combined efforts short circuit the time, cost and risk associated with full-custom layout, letting companies in the medical, industrial, communications, sensor and other sectors achieve cost-effective, high-performance mixed-signal ASIC designs.”
About Arrow North American Components
The North American Components (NAC) business of Arrow Electronics, Inc. is a leading provider of semiconductors and passive, electromechanical and connector products, computing solutions, services and supply-chain solutions tailored to serve distinct customer segments with dedicated sales teams. Two primary, customer-focused NAC groups serve these market segments: The Arrow Electronics Components Group serves North American-based OEM and contract manufacturing customers and the Arrow/Zeus Electronics Group targets the aerospace and military markets.

Arrow Electronics, Inc. (www.arrow.com) is a global provider of products, services and solutions to industrial and commercial users of electronic components and computer products.

About Triad Semiconductor
Triad Semiconductor is a fabless ASIC company that develops, prototypes and produces mixed-signal ASICs for production volumes from the low thousands to millions. Its patent-pending Via Configurable Array (VCA) technology creates ASIC arrays with silicon-proven analog and digital functions, reducing the time, cost and risk associated with full custom layout. Triad’s via-only routing also significantly reduces engineering effort and fabrication time, resulting in fast-turn prototypes and design changes at minimal cost. Founded in 2003 and privately held, Triad is headquartered in Winston Salem, N.C. For more information, visit www.triadsemi.com.

###

Media Contacts:

John Hourigan
Director, External Communications
Arrow Electronics, Inc.
303-824-4586
jhourigan@arrow.com

Sarah Miller for Triad Semiconductor
ThinkBold Corporate Communications
231-264-8636
sarah@thinkbold.com

Triad announces availability of its new LVDS Transmitter and Receiver drivers.

These drivers can be used in such applications as; High Speed Backplane Driver, Complementary Clock Drivers, Level Translator, System Interconnects, ATM Applications, SDH Applications, High-Resolution Imaging Applications, Laser Printers, Digital Copiers, Stackable hubs for data communications, Digital Video, and High Definition Television.

Both the transmitter (LVDS_TX) and receiver (LVDS_RX) drivers support data rates up to 1Gb/s (500MHz). The LVDS_TX accepts CMOS input levels and translates them into low voltage 350mV differential output signals. The LVDS_RX accepts 350mV differential input signals and translates them to CMOS output levels. When using both blocks together in an application it provides a new alternative to high power pseudo-ECL devices for high speed applications.

For more information about these drivers, please visit the Interface section of our online IP catalog.

Winston Salem, NC - Triad Semiconductor, Inc, a worldwide leader in providing mixed-signal ASICs, today announced the launch of the Triad Alliance Program. Telesensors, Inc. has been appointed a Triad Authorized Design Center and a member of the Triad Alliance Program. The Triad Alliance includes Authorized Design Centers, Design Centers Partners, Triad IP Providers, EDA Vendors and ASIC Companies. Triad Semiconductor customers will be able to choose from Alliance members for state-of-the-art design services, silicon-proven IP and platform-ready tools. The Triad Alliance will speed time to market while reducing customer design risk and cost.

The Authorized Design Center Program provides extensive training on the Triad via configurable array (VCA) technology, access to Triad EDA tools, continuing development support and access to the latest platform configurations. In addition, Authorized Design Centers have developed, fabricated and tested target application through the VCA process. This assures first-pass success as these Design Centers support Triad Semiconductor customers. Telesensors has an experienced engineering team with a wide range of systems and ASIC experience. “We are excited about adding Telesensors to our program and look forward to continued collaboration,” said Mike LoDebole, vice president of sales for Triad Semiconductor. Telesensors has recently taped out and successfully tested circuits in support of their Smart Sensors platforms, which combine sensing, wireless, and ASIC technologies for products in the homeland security and medical markets.

Dan Blankenship, Telesensors COO added, “We have been working closely with the Triad team in the development of Smart Sensor platforms using Triad’s VCA technology. The training and support they have provided has been exceptional. Their VCA technology has played a significant role in our ability to meet the needs of our customers. Moving forward we see many opportunities to apply their VCA platforms in creating our integrated Smart Sensors.”

About Telesensors, Inc.
Telesensors is developing the next generation of intelligent wireless sensors, called Smart Sensors. Smart Sensors are low cost, wireless integrated circuits that can detect nuclear, chemical, or biological agents, as well as more conventional environmental conditions, such as temperature. Smart Sensors achieve low cost due to a high level of integration and the efficient use of the silicon die. Smart Sensors communicate within a secure wireless networked environment. These capabilities enable Smart Sensors to be deployed in the high quantities necessary to provide effective monitoring of environmental conditions. A distributed approach to environmental monitoring is far more cost-effective than conventional and expensive point-type solutions.

About Triad Semiconductor, Inc.
Triad Semiconductor is a fabless ASIC company offering the only viable technology for the fastest time to market with the lowest risk and lowest total cost of ownership for mixed-signal ASICs. The company�s patent-pending via configurable array (VCA) technology creates ASIC arrays that contain silicon-proven analog and digital functions. High performance designs can now be achieved without the time and cost associated with full-custom layout. Via-only routing allows for significant reduction in engineering hours and fabrication time. VCA means fast-turn prototypes and design changes at minimal cost. Triad supports ASIC from low 1,000s to >1M devices.

Started in 2003, Triad is privately held, headquartered in Winston Salem, North Carolina. For additional information, please visit www.triadsemi.com.

Contacts:
Triad Semiconductor - Mike LoDebole, (336) 721-9450, info_at_triadsemi.com
Cayenne Communication - Linda Marchant, (919) 451-0776, linda.marchant_at_cayennecom.com

Senior Digital / Mixed Signal Integrated Circuit Design Engineer

This individual shall be the technical leader for a mixed signal design team. As a member of the senior management team, this individual will be responsible for the development of the Company’s Mixed Signal Via Configurable Arrays from concept to production.

Tasks/responsibilities Include: high-level design and simulation; transistor/gate level design and simulation; layout and layout supervision, characterization and supervision of production test system development. In addition, this individual will be responsible for the development and evaluation of digital IP blocks.

Requirements:

• 8+ years experience in Digital and/or Mixed signal IC Design
• BSEE from accredited engineering program
• Self motivated
• Desire to work for young growing company
• Excellent verbal and written communication skills
• Strong background in Verilog HDL for digital ASIC development
• Experience with full-custom IC layout
• Experience in IC layout verification (LVS and DRC)

Preferences:

• MSEE
• Familiarity with Mentor EDA Tools
• Analog IC design and layout experience
• Use of Mentor Graphics EDA Tools
• ADC/DAC design
• Experience in high voltage CMOS design
• I/O design for ESD protection

Triad Semiconductor is the Mixed Signal Via-Configurable ASIC Company. Get in on the ground floor of a company that’s bringing to market a unique and exciting technology. We offer excellent opportunities for highly motivated, technically able individuals who thrive in an entrepreneurial environment.

No recruiters please.

Triad was recently featured in the July 2006 edition of the Semiconductor Times Magazine which focuses on emerging semiconductor technologies and companies…

Triad Semiconductor was founded in April 2002 to develop custom mixed signal solutions. When we spoke with Triad in early 2004, the company planned to offer custom mixed-signal ICs as well as various standard products, including the TSX0 Capacitive Sensor Interface, TSX1 Universal Smart Sensor Interface and TSX10 Acoustic Emission Processor.

The company reincorporated in Florida in 2003 after receiving private funding and spent 2004 and 2005 developing its patented mixed signal Via Configurable Array (VCA) solutions. Triad is now a configurable ASIC company focused on mixed signal VCA solutions. The company has been funded by the founders and private investors to date and does not have any plans to raise venture capital. Triad has roughly 12 employees.

A Structured ASIC ‘pre-diffuses’ logic, memory, and I/O elements into the majority of layers used to define an IC. To configure a specific design onto the structured array, a designer is given access to some of the metal and via layers. The pre-diffused structured ASIC platform can be manufactured ahead of time and staged at the foundry resulting in greatly reduced fabrication time.

Triad brings the benefits of structured arrays to mixed signal IC design. The company’s mixed signal platforms enable the design of analog and digital circuitry on a single die with only one fabrication mask. By using this approach, companies benefit from reductions in mask costs, place & route time, fabrication time and overall project cost.

Triad’s VCA solution provides for significant reduction in development time, cost, and risk compared to other methods of mixed signal IC development. Its structured array technology features low NREs, shorter design schedules, minimal risk of re-spins, prototypes 4 weeks from tape-out, production 4-6 weeks from PO, and high volume availability.

In VCA technology, analog and digital circuitry are pre-diffused into the die and a single mask layer, the via layer between metal 2 and metal 3 routing layers, is used for application specific wiring. When a customer’s design is released to fabrication, only one mask layer needs to be created and only the layers above Metal 2 need to be processed at the foundry, reducing fabrication time from months to weeks.

Development schedules can be significantly shortened because of support for schematic-based analog design and the availability of reusable, soft analog-IP. Users can build their custom applications using industry-standard HDL and schematic capture methods. Triad software places, configures, and interconnects the user’s design onto the VCA platforms.

In contrast to full custom mixed-signal ASICs, the use of silicon proven components significantly improves the chances of first pass success.

VCA Platforms are constructed out of repeated analog and digital tiles. Each analog tile contains a mix of low complexity devices such as resistors, capacitors, and discrete transistors as well as higher complexity functions such as Operational Transconductance Amplifiers (OTAs), Output Stages, and various switch types. Additionally, each analog tile contains local logic gates that can be used to create non-overlapping clocks for driving switched capacitor circuits. Digital logic tiles known as full tiles contain 1,500 logic gates and an embedded 64×32 single-port SRAM.

Triad pre-configures ASIC arrays with silicon proven analog and digital resources such as Op-Amps, A/D & D/A converters, digital logic, memory, EEPROM, etc. and then overlays these elements with a global Metal 2 and Metal 3 routing fabric. These devices are then staged at the foundry where they can be configured by users with a single mask layer.

VCA platforms are configured and elements interconnected using Triad’s via-only place and route software. Vias are employed to interconnect primitive elements and to configure element parameters such as bias current, memory configuration, flip-flop type, etc. The use of small Metal 2 and 3 matrices rotated and overlapped in this fashion results in a routing fabric that supports dense, compact designs. Triad has purchased ViASIC’s ViaPATH structured ASIC routing software that requires only a single mask layer change for fabrication and the two companys share common investors.

Triad’s basic building blocks are referred to as Platform IP (PIP). PIPs are silicon-proven, characterized IP functions that are combined to create Triad VCA platforms.

The Analog Platform IP includes General Purpose Analog Tile, Low-Power Analog Tile, Fully Differential Analog Tile, Low-Noise Analog Tile, Wideband Analog Tile, Ultra-Wideband Analog Tile, Band-Gap Reference, Voltage Divider Network, Temperature Sensor, Programmable Oscillator, 8- and 10-bit ADCs and DACs, Configurable I/O and Isolated Analog Power. The Digital Platform IP includes Logic Tile, Distributed SRAM, Block ROM, EEPROM, Configurable I/O and Isolated Digital Power.

VCA Platforms consist of various arrangements of these resources to create a family of ICs with a range of analog and digital capacities. Triad platforms are available with logic gate counts from 1,500 to 150,000 gates and with analog resources that include from 12 to 60 Op-Amps. The Triad VCA Platform family is comprised of the VCA-5 Ultra Wideband Platform, VCA-1 General Purpose Platform, VCA-4 Low-Power, Nonvolatile Platform, and VCA-3 Cost-Sensitive, Analog Platform.

The VCA-5 Ultra Wideband Platform has 150,000 Logic Gates, 200 64×16 SRAM, 6 Ultra-Wideband Tiles, 7 Fully Differential Tiles, 8 General Purpose Tiles, 4 Dual Wideband Tiles, 4 Wideband/Low-Noise Tiles, 4 10-bit DACs, 2 8-bit ADCs, Temperature Sensor, Programmable Oscillator and Band Gap, Voltage Ref Network.

The general purpose VCA-1 has 40,000 Logic Gates, 27 64×32 SRAM, 18K Bytes ROM, 12 General Purpose Tiles, 4 Widebeand/Low-Noise Tiles, 2 Dual Wideband Tiles, 2 10-bit DACs, 8-bit ADC and Band Gap, Voltage Ref Network.

Targeted at the ultra-low power mixed signal market, the VCA-4 has 15,000 Logic Gates, 20 64×16 SRAM, 8K Bytes EEPROM, 10 Low-Power Tiles, 10-bit DAC, 8-bit ADC, Temperature Sensor, Programmable Osc and Band Gap, V Ref.

For cost sensitive applications, the VCA-3 has 1,500 Logic Gates, 2 64×16 SRAM, 1K Bytes ROM, 6 Low-Power Tiles, 10-bit DAC, 8-bit ADC, Temperature Sensor, Programmable Osc, Band Gap, V Ref and High Current H-Bridge.

Various configurable mixed-signal and analog approaches have been tried over the years. Field programmable mixed-signal platforms tend to be inefficient and expensive. Popular devices like Cypress’s software configurable pSOC target low-end analog applications. Many of these devices focus on the digital logic while providing minimal analog functionality.

Triad is squarely focused on sophisticated analog functionality, primarily for sensor applications, and its devices provide rich analog functionality compared to other alternatives. Its solutions are far more attractive than full customer alternatives. Few other companies offer a single layer via configurable technology, which Triad has patented.

Sensors, RFID, and military comprise Triad’s primary application base. Ideal target customers are those that already have experience with mixed signal ASICs and can appreciate the benefits of Triad’s approach. For customers that can hand off GDS II using Triad’s toolkit, the company can provide a handful of parts in several weeks for only $25,000 and argues that design time is typically cut in half using its silicon proven IP.

Average production pricing ranges from $5 to $7 and Triad believes its platform provides a cost-effective approach for volumes as low at 10Ku.

Triad VCA platforms are fabricated at Austria Micro Systems using 0.35u, 4 metal, 2 poly CMOS that is optimized for low noise, low power applications. Additional processing steps are available to add EEPROM, high voltage processing and BiCMOS. The VCA-1 entered production in early 2006. The VCA-4 and VCA-5 are sampling now with production scheduled for later this year. The VCA-3 will soon follow. The company has a comprehensive product roadmap, including a migration to 0.18u technology to enable higher digital logic integration, and possibly high voltage functionality.

Lynn Hayden, President, CEO, Secretary, Treasurer (previously founder, president and CEO of Coiltronics, which was sold to a large multinational corporation)

James Kemerling, CTO & Co-Founder (most recently VP of Product Development for MXCOM)

Mike LoDebole, VP of Sales (previously a sales manager with AMI)

3900 Westpoint Blvd, Suite D
Winston-Salem, NC 27103
Tel: 336.721.9450
Fax:336.721.9480
www.triadsemi.com

Copyright 2006, Pinestream Communications, Inc. 52 Pine Street, Weston, Massachusetts 02493 USA

Tel 781.647.8800 Fax 781.647.8825 www.pinestream.com info@pinestream.com

This article reprinted with permission from Pinestream Communications

The Business Journal of the Greater Triad Area - July 28, 2006 by Matt Evans

Triad Semiconductor, which is pioneering a faster and less-expensive method of designing computer chips, has expanded into a larger facility in Winston-Salem.

It also hopes to see a boost when its cutting-edge technology is incorporated into the engineering program at N.C. State University in Raleigh this fall.

The 13-person company moved into a 6,000-square-foot facility near Stratford Road June 1, according to CEO Lynn Hayden. The new space will allow the company to accommodate the growth that has come with a doubling of revenues over the past year, a pace Hayden anticipates will continue for the next several years.

“We outgrew our old location” in the Piedmont Triad Research Park, Hayden said. Instead of moving to a bigger space within the research park, Triad Semiconductor decided to triple its space at another site.

While the company has not yet begun to turn a profit, Hayden expects to reach a positive cash flow in the next 12 to 15 months. It also plans to hire five additional staffers, including engineers, by the end of this year.

Some of that growth may come as a result of a partnership with N.C. State that will see students in the university’s system engineering classes making use of Triad Semiconductor’s “via-configurable array” technology to design circuits. That technology, according to Chief Technical Officer Jim Kemerling, allows the engineer to design a circuit on top of a “base array” layer that performs many of the back-end functions that have to be handled separately in a fully customized microchip.

“Our customers can easily, relative to designing a whole chip, configure that array using that single layer,” which can be done at about one-tenth the cost and one-quarter of the time of fully-customized chip design, Kemerling said. Chips designed on Triad Semiconductor’s platform are used in applications ranging from tire pressure gauges to medical devices, and can be applied to just about anything that uses sensors or other electronics, he said.

Cheaper and faster is good for customers for obvious reasons, according to N.C. State engineering professor Kevin Gard. But students will benefit because Triad Semiconductor’s technology will allow them to design, fabricate and evaluate a full circuit in the time span of a single semester, which hasn’t been possible using traditional methods.

“It allows the students to innovate in the circuit design without having to worry about all the other things associated with doing an integrated circuit,” such as laying out schematics and doing manual verifications that take a long time but are repetitive and don’t contribute much to the learning, Gard said.

Triad Semiconductor will make a significant investment in the partnership by working directly with students and fabricating the chips they design, Hayden said. He thinks it will be worth it, though, to have new engineers entering the marketplace trained on their technology and either coming to work directly for Triad Semiconductor or telling their future employers about it.

“It’s a small world out there, and getting smaller all the time,” Hayden said. “Word of mouth is the best advertising.”

Triad Semiconductor

CEO: Lynn Hayden
Address: 3900 West Point Blvd., Winston-Salem 27103
Phone: (336) 774-2150
No. of employees: 13
Web site: www.triadsemi.com