What:
Triad will be exhibiting the company’s groundbreaking via-configurable array (VCA) technology to integrate analog, digital, memory and processor solutions for single-chip ASICs or system-on-chip (SoC). Triad’s VCA technology combines silicon-proven resources on a single ASIC die. Unique to Triad’s patented VCA approach is the ability to configure and interconnect this rich set of resources using only a single via mask layer. This approach shortens time to prototypes and time to market, reduces development and tooling costs, and accelerates the design process by enabling the reuse of proven mixed-signal IP blocks. Please see http://www.triadsemi.com/vca-technology/ for additional detail.

When:

• Santa Clara, CA — Thursday, October 8, 2009
  • Exhibition hours –3:30pm to 7:30pm
• Mississauga, Ontario, Canada – Tuesday, October 20, 2009
  • Exhibition hours — 3:00pm to 7:30pm
• Lowell, MA – Thursday, October 29, 2009
  • Exhibition hours — 2:00pm to 7:00pm

Where:

• California — Embassy Suites Hotel-Santa Clara, 2885 Lakeside Drive, Santa Clara, CA
• Ontario, Canada — Mississauga Convention Centre, 75 Derry Road, Mississauga, Ontario L5W 1G3
• Massachusetts — Paul E. Tsongas Arena, 300 Martin Luther King Jr. Way, Lowell, MA 01852

For additional conference details, see http://www.arrowfest.com/about/

About Triad Semiconductor, Inc.
Triad Semiconductor, Inc., a privately held fabless semiconductor company with headquarters in Winston-Salem, North Carolina, develops, prototypes and produces mixed-signal ASICs. The company’s groundbreaking via-configurable array (VCA) technology delivers ASICs with silicon-proven analog and digital functions more quickly and at lower cost than traditional full-custom approaches. Triad’s single-mask, via-only routing cuts engineering effort and fabrication time, resulting in fast-turn prototypes and allowing design changes to be made at minimal cost. For more information, please visit www.triadsemi.com or call (336) 774-2150.

Mocha is a trademark of Triad Semiconductor, Inc.
All other product or service names are the property of their respective owners. All rights reserved.

# # #

Editorial Contact:
Linda Marchant, Cayenne Communication LLC, 919-451-0776 or linda.marchant@cayennecom.com

These drivers can be used in such applications as; High Speed Backplane Driver, Complementary Clock Drivers, Level Translator, System Interconnects, ATM Applications, SDH Applications, High-Resolution Imaging Applications, Laser Printers, Digital Copiers, Stackable hubs for data communications, Digital Video, and High Definition Television.

Both the transmitter (LVDS_TX) and receiver (LVDS_RX) drivers support data rates up to 1Gb/s (500MHz). The LVDS_TX accepts CMOS input levels and translates them into low voltage 350mV differential output signals. The LVDS_RX accepts 350mV differential input signals and translates them to CMOS output levels. When using both blocks together in an application it provides a new alternative to high power pseudo-ECL devices for high speed applications.

For more information about these drivers, please visit the Interface section of our online IP catalog.

The Authorized Design Center Program provides extensive training on the Triad via configurable array (VCA) technology, access to Triad EDA tools, continuing development support and access to the latest platform configurations. In addition, Authorized Design Centers have developed, fabricated and tested target application through the VCA process. This assures first-pass success as these Design Centers support Triad Semiconductor customers. Telesensors has an experienced engineering team with a wide range of systems and ASIC experience. “We are excited about adding Telesensors to our program and look forward to continued collaboration,” said Mike LoDebole, vice president of sales for Triad Semiconductor. Telesensors has recently taped out and successfully tested circuits in support of their Smart Sensors platforms, which combine sensing, wireless, and ASIC technologies for products in the homeland security and medical markets.

Dan Blankenship, Telesensors COO added, “We have been working closely with the Triad team in the development of Smart Sensor platforms using Triad’s VCA technology. The training and support they have provided has been exceptional. Their VCA technology has played a significant role in our ability to meet the needs of our customers. Moving forward we see many opportunities to apply their VCA platforms in creating our integrated Smart Sensors.”

About Telesensors, Inc.
Telesensors is developing the next generation of intelligent wireless sensors, called Smart Sensors. Smart Sensors are low cost, wireless integrated circuits that can detect nuclear, chemical, or biological agents, as well as more conventional environmental conditions, such as temperature. Smart Sensors achieve low cost due to a high level of integration and the efficient use of the silicon die. Smart Sensors communicate within a secure wireless networked environment. These capabilities enable Smart Sensors to be deployed in the high quantities necessary to provide effective monitoring of environmental conditions. A distributed approach to environmental monitoring is far more cost-effective than conventional and expensive point-type solutions.

About Triad Semiconductor, Inc.
Triad Semiconductor is a fabless ASIC company offering the only viable technology for the fastest time to market with the lowest risk and lowest total cost of ownership for mixed-signal ASICs. The company�s patent-pending via configurable array (VCA) technology creates ASIC arrays that contain silicon-proven analog and digital functions. High performance designs can now be achieved without the time and cost associated with full-custom layout. Via-only routing allows for significant reduction in engineering hours and fabrication time. VCA means fast-turn prototypes and design changes at minimal cost. Triad supports ASIC from low 1,000s to >1M devices.

Started in 2003, Triad is privately held, headquartered in Winston Salem, North Carolina. For additional information, please visit www.triadsemi.com.

Contacts:
Triad Semiconductor – Mike LoDebole, (336) 721-9450, info_at_triadsemi.com
Cayenne Communication – Linda Marchant, (919) 451-0776, linda.marchant_at_cayennecom.com

This individual shall be the technical leader for a mixed signal design team. As a member of the senior management team, this individual will be responsible for the development of the Company’s Mixed Signal Via Configurable Arrays from concept to production.

Tasks/responsibilities Include: high-level design and simulation; transistor/gate level design and simulation; layout and layout supervision, characterization and supervision of production test system development. In addition, this individual will be responsible for the development and evaluation of digital IP blocks.

Requirements:

• 8+ years experience in Digital and/or Mixed signal IC Design
• BSEE from accredited engineering program
• Self motivated
• Desire to work for young growing company
• Excellent verbal and written communication skills
• Strong background in Verilog HDL for digital ASIC development
• Experience with full-custom IC layout
• Experience in IC layout verification (LVS and DRC)

Preferences:

• MSEE
• Familiarity with Mentor EDA Tools
• Analog IC design and layout experience
• Use of Mentor Graphics EDA Tools
• ADC/DAC design
• Experience in high voltage CMOS design
• I/O design for ESD protection

Triad Semiconductor is the Mixed Signal Via-Configurable ASIC Company. Get in on the ground floor of a company that’s bringing to market a unique and exciting technology. We offer excellent opportunities for highly motivated, technically able individuals who thrive in an entrepreneurial environment.

No recruiters please.

Triad Semiconductor was founded in April 2002 to develop custom mixed signal solutions. When we spoke with Triad in early 2004, the company planned to offer custom mixed-signal ICs as well as various standard products, including the TSX0 Capacitive Sensor Interface, TSX1 Universal Smart Sensor Interface and TSX10 Acoustic Emission Processor.

The company reincorporated in Florida in 2003 after receiving private funding and spent 2004 and 2005 developing its patented mixed signal Via Configurable Array (VCA) solutions. Triad is now a configurable ASIC company focused on mixed signal VCA solutions. The company has been funded by the founders and private investors to date and does not have any plans to raise venture capital. Triad has roughly 12 employees.

A Structured ASIC ‘pre-diffuses’ logic, memory, and I/O elements into the majority of layers used to define an IC. To configure a specific design onto the structured array, a designer is given access to some of the metal and via layers. The pre-diffused structured ASIC platform can be manufactured ahead of time and staged at the foundry resulting in greatly reduced fabrication time.

Triad brings the benefits of structured arrays to mixed signal IC design. The company’s mixed signal platforms enable the design of analog and digital circuitry on a single die with only one fabrication mask. By using this approach, companies benefit from reductions in mask costs, place & route time, fabrication time and overall project cost.

Triad’s VCA solution provides for significant reduction in development time, cost, and risk compared to other methods of mixed signal IC development. Its structured array technology features low NREs, shorter design schedules, minimal risk of re-spins, prototypes 4 weeks from tape-out, production 4-6 weeks from PO, and high volume availability.

In VCA technology, analog and digital circuitry are pre-diffused into the die and a single mask layer, the via layer between metal 2 and metal 3 routing layers, is used for application specific wiring. When a customer

Triad Semiconductor, which is pioneering a faster and less-expensive method of designing computer chips, has expanded into a larger facility in Winston-Salem.

It also hopes to see a boost when its cutting-edge technology is incorporated into the engineering program at N.C. State University in Raleigh this fall.

The 13-person company moved into a 6,000-square-foot facility near Stratford Road June 1, according to CEO Lynn Hayden. The new space will allow the company to accommodate the growth that has come with a doubling of revenues over the past year, a pace Hayden anticipates will continue for the next several years.

“We outgrew our old location” in the Piedmont Triad Research Park, Hayden said. Instead of moving to a bigger space within the research park, Triad Semiconductor decided to triple its space at another site.

While the company has not yet begun to turn a profit, Hayden expects to reach a positive cash flow in the next 12 to 15 months. It also plans to hire five additional staffers, including engineers, by the end of this year.

Some of that growth may come as a result of a partnership with N.C. State that will see students in the university’s system engineering classes making use of Triad Semiconductor’s “via-configurable array” technology to design circuits. That technology, according to Chief Technical Officer Jim Kemerling, allows the engineer to design a circuit on top of a “base array” layer that performs many of the back-end functions that have to be handled separately in a fully customized microchip.

“Our customers can easily, relative to designing a whole chip, configure that array using that single layer,” which can be done at about one-tenth the cost and one-quarter of the time of fully-customized chip design, Kemerling said. Chips designed on Triad Semiconductor’s platform are used in applications ranging from tire pressure gauges to medical devices, and can be applied to just about anything that uses sensors or other electronics, he said.

Cheaper and faster is good for customers for obvious reasons, according to N.C. State engineering professor Kevin Gard. But students will benefit because Triad Semiconductor’s technology will allow them to design, fabricate and evaluate a full circuit in the time span of a single semester, which hasn’t been possible using traditional methods.

“It allows the students to innovate in the circuit design without having to worry about all the other things associated with doing an integrated circuit,” such as laying out schematics and doing manual verifications that take a long time but are repetitive and don’t contribute much to the learning, Gard said.

Triad Semiconductor will make a significant investment in the partnership by working directly with students and fabricating the chips they design, Hayden said. He thinks it will be worth it, though, to have new engineers entering the marketplace trained on their technology and either coming to work directly for Triad Semiconductor or telling their future employers about it.

“It’s a small world out there, and getting smaller all the time,” Hayden said. “Word of mouth is the best advertising.”

Triad Semiconductor

CEO: Lynn Hayden
Address: 3900 West Point Blvd., Winston-Salem 27103
Phone: (336) 774-2150
No. of employees: 13
Web site: www.triadsemi.com

The complete job description can be found here…

Triad’s MSSA technology is a great way to extend this concept. With our reusable analog IP you can create a single chip solution that better matches your system requirements:

Design a Analog JTAG System with:

• 12, 16, or more channels of voltage acquisition
• Add a voltage output DAC
• Capacitive Sensor Interface
• Low-Pass Filtering of voltage inputs
• Magnetic Sensor Interface
• Current Sensing

For military, industrial, and medical applications, you can create a solution that matches your specifications with very low NRE and pricing that is reasonable even in small quantities.

We’ve been listening to our customers and we will soon be announcing a new platform:

MSSA-LP

Low Power Mixed Signal Structured ASIC Platform.

The MSSA-LP or MSSA-4 as it is also known is optimized for low-power, battery-powered applications such as:

Handheld devices
Medical products
RFID (battery assisted)
Cargo Tracking
Cold-Chain Management (making sure a shipment of Salmon stays cold)
Smart Sensor Networks

The MSSA-4 contains:

10 Low Power Tiles
Temperature Sensor
Onboard Oscillator
8-bit ADC
10-bit DAC
15K Logic Gates
20 64×16 SRAM
4Kx16 EEPROM
Programmable Digital I/O
Analog I/O
Separate Analog and Digital Power

The OpAmps in the low power tile need on 50 nA of bias current!
Stay tuned for more info on the blog and in the Podcast.

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