Triad Semiconductor’s Reid Wender, VP of Marketing, will be speaking at the November 18th meeting of the IEEE MTTS Chapter in Camarillo, CA on November 18, 2009. During his presentation, Wender will be reviewing the steps in a typical ASIC design followed by an overview of how VCA technology with a single metal layer of interconnects works to minimize program risks.
For more details, please see the corresponding events calendar post.