Archive for October 2009

Triad’s VP of Marketing to Speak at the IEEE MTTS Chapter on Nov 18

Triad Semiconductor’s Reid Wender, VP of Marketing, will be speaking at the November 18th meeting of the IEEE MTTS Chapter in Camarillo, CA on November 18, 2009. During his presentation, Wender will be reviewing the steps in a typical ASIC design followed by an overview of how VCA technology with a single metal layer of [Read more...]

IEEE MTTS Chapter Meeting

Triad’s Reid Wender, Vice President of Marketing, will be speaking at the IEEE MTTS Chapter on November 18th at 7:00pm. Wender’s topic will be “The Path to Quick & Inexpensive True Mixed-Signal Design with Incorporation of ARM Cortex Cores & 1 Million ASIC Gates.”

Triad Semiconductor to Exhibit at International SoC Conference and Present on Via-configurable, Mixed-signal Embedded ASICs Using the ARM Cortex-M0 Microcontroller

WINSTON-SALEM, N.C. – October 27, 2009 – Triad Semiconductor Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, will demonstrate its silicon-proven via-configurable array (VCA) technology for analog, digital and mixed-signal design at the 7th International System-on-chip (SoC) Conference and Workshops in Newport Beach, California, on November 4th, 2009.  The company’s CTO, Jim Kemerling, also [Read more...]

SoC Conference

Triad Semiconductor will be at the 7th International SoC Conference. Booth TBA.

ARM Developer’s Conference – Techcon3

Triad Semiconductor will be at the ARM Developer’s Conference (Techcon3). Booth #815